Daily semiconductor & ai infrastructure with a Malaysian business lens — facts, analysis, and the Agentic AI angle, sources cited.
Data centres are moving away from running AI on a single type of chip. According to Semiconductor Engineering, four pre…
Nvidia has announced the Rubin CPX, a single-die accelerator designed specifically for the "prefill" phase of AI infere…
Semiconductor Engineering, a trade publication read closely by chip engineers, has published an analysis arguing that b…
Researchers from Google and Delft University of Technology (TU Delft) have published a technical paper detailing a new…
SemiAnalysis has published a detailed benchmark comparison between Nvidia's current-generation H100 (Hopper) and next-g…
The 2025 VLSI Symposium — the semiconductor industry's premier conference for chip design and manufacturing breakthroug…
Semiconductor Engineering's latest weekly review packs in ten developments: a new Micron lab, a jump in chip/AI prices,…
Semiconductor Engineering, a leading trade publication for chip design and manufacturing engineers, published an analys…
The latest Semiconductor Engineering weekly review packs in more signal than most quarters do: Lam Research and ASE are…
Researchers at UCLA have published a technical paper asking a deceptively simple question: can LLM-based AI agents desi…
Researchers at NIST (the US National Institute of Standards and Technology), UC San Diego and colleagues have published…
Researchers at the National University of Singapore (NUS) have published a technical paper called CHIPSMORE, describing…
Semiconductor Engineering's piece on smart outlier detection makes one pointed argument: a chip that passes every test…
Semiconductor Engineering reports that the explosion in AI compute demand is forcing data centre operators to rethink h…
Semiconductor Engineering, a specialist publication for chip and systems engineers, has published an analysis arguing t…
Semiconductor Engineering, a specialist publication for chip design engineers, has published a piece titled "Trust, But…
Researchers at the University of Alberta have published a technical paper, "PPAPlace: Differentiable Cross-Stage Object…
Semiconductor Engineering has published guidance urging engineering teams to plan their AI adoption by starting with a…
Penang is experiencing its most significant industrial transformation since the 1970s free-trade-zone era. The converge…
Self-verifying agentic AI workflows in Electronic Design Automation (EDA) represent a critical shift from AI that merel…
Semiconductor Engineering's August 10 technical paper roundup highlights eight research advances spanning optical switc…
AI data centre growth is being throttled by supply chain bottlenecks across semiconductors, advanced packaging, and pow…
Researchers at Imperial College London and the University of Exeter have published a technical paper demonstrating ultr…
Imec, the Belgium-based nanoelectronics research centre, has published a technical paper titled "Bond Front Velocity in…